高速半导体激光器同轴封装结构参数分析  

Analysis of Structure Parameters of the Coaxial Package with High-Speed Semiconductor Lasers

作　　者：刘勇[1] 吴振刚[1] 周雷[1] 王燕飞[1] 

机构地区：[1]中国电子科技集团公司第8研究所,合肥230041

出　　处：《中国电子科学研究院学报》2015年第4期350-354,366,共6页Journal of China Academy of Electronics and Information Technology

摘　　要：对于高速半导体激光器(LD),由于同轴封装结构参数对高速LD组件耦合效率的影响,导致高速LD的性能下降。为了合理设置高速LD同轴封装结构参数,详细分析高速LD同轴封装结构参数对高速LD组件耦合效率的影响,并得出结论:减少高速LD管帽的高度和透镜的大小,增加透镜的折射率可以提高高速LD封装的耦合效率。The influence of the coaxial package parameters for the high-speed semiconductor laser （LD） on coupling efficiencies of high-speed LD components results in the decrease of high-speed LD index. In order to set up structure parameters of the high-speed LD modules on coaxial packages, the dependence of the coupling efficieneies of the high-speed LD modules on structure parameters of coaxial package are analyzed in detail, proposing conclusion that the coupling efficiencies of the high-speed LD components can be improved by decreasing the height of the cap or the size of the lens and increasing the refractive index of the lens in the high-speed LD.

关 键 词：半导体激光器 高速 耦合效率 同轴封装 结构参数 

分 类 号：TN305.94[电子电信—物理电子学]