离子交换法处理集成电路封装有机废水的研究  

Research on Treating Integrated Circuit Package Organic Wastewater by Ion Exchange Processing

作　　者：杨为[1] 马晓鸥[1] 陈妍娜 许江波[1] 费继宏 

机构地区：[1]五邑大学化学与环境工程学院,广东江门529020

出　　处：《五邑大学学报（自然科学版）》2015年第3期23-26,31,共5页Journal of Wuyi University(Natural Science Edition)

摘　　要：采用离子交换法处理集成电路封装去胶产生的有机废水.静态实验研究结果表明,弱酸型阳离子交换树脂OD5对该废水中的有机物具有吸附容量大、再生性能好等特点.废水经10.0g树脂吸附后,COD从760.0mg/L降至272.6mg/L;再经芬顿氧化,废水COD降至55.2mg/L,COD总去除率达到92.7%.吸附动力学研究表明,OD5树脂吸附COD受内扩散控制,吸附速率常数为k=7.6×10-3min-1.Ion exchange processing was adopted to treat organic wastewater produced by integrated circuit packaging industry. Static experiment research results show that weak acid cation resin OD5 has a large adsorption capacity for organic matter and good regeneration performance. After absorption by 10.0 g resin, the concentration of COD in the wastewater dropped from 760.0 mg/L to 272.6 mg/ L ; after Fenton oxidation, the concentration of COD further dropped to 55.2 mg/ L. The total removal rate of COD was up to 92.7%. Adsorption kinetics research shows that the adsorption of COD by OD5 resin is controlled by internal diffusion and the adsorption rate constant is k=7.6×10^-3min^-1 .

关 键 词：离子交换法 集成电路封装 有机废水 

分 类 号：X703[环境科学与工程—环境工程]