光互连背板的发展现状  

The development review of the optical interconnecting backplanes

作　　者：刘秋华[1] 吴小龙[1] 方庆玲[1] 

机构地区：[1]江南计算技术研究所,江苏无锡214083

出　　处：《印制电路信息》2015年第9期44-45,60,共3页Printed Circuit Information

摘　　要：文章概述了光互连背板的发展现状和应用前景,着重介绍了光互连背板的关键材料光波导及其性能指标、加工工艺,并列举了几个重要的光互连背板相关研究工作。This article reviewed the development of the FANG Qing-ling optical backplanes, and introduced the interested materials waveguides, including their properties index which related to their performance, and the fabricating process. Several worldwide works were also liOptical interconnects; backplanes; waveguide; UV exposure.-sted here.

关 键 词：光互连 背板 波导 UV曝光 

分 类 号：TN41[电子电信—微电子学与固体电子学]