激光辐照下硅材料温度分布研究  

Research on Temperature Distribution of Silicon Material Irradiated by Laser

作　　者：韩微微[1] 赵万利[2] 

机构地区：[1]中国电子科技集团公司第四十五研究所,北京100176 [2]光电信息控制和安全技术重点实验室,河北三河065201

出　　处：《光电技术应用》2015年第4期8-10,38,共4页Electro-Optic Technology Application

摘　　要：激光加工硅材料过程中产生的热效应现象对产品良率有不良影响。为了降低热效应现象的影响,对激光辐照硅材料表面时硅材料的温度升高与分布情况进行了研究。使用光纤连续激光器作为光源辐照硅材料表面,记录了硅材料在不同激光功率密度和照射时间情况下的温度升高与分布情况,得到了实验数据。并根据实验条件和参数进行了仿真建模和模拟计算,得到了激光辐照下硅材料温度分布模型,该模型仿真数据与实验结果基本吻合,可通过修改该模型参数进行激光加工进行模拟实验,为激光加工时的参数选择提供了实验依据。The temperature rising and distribution of silicon material irradiated by laser are researched for re？ducing the influence of heat effect. A fiber continuous laser is used as a light power to irradiate silicon material sur？face to record the temperature rising and distribution of silicon material under different laser power density and irra？diation time. And experimental data is obtained. According to experimental conditions and parameters, simulation and calculation are performed to get the temperature distribution model of silicon material under laser irradiation. The simulation data of the model accords with the experimental results. Laser cutting simulation experiment can be performed through correcting the parameters of the model, which provides experimental reference for parameter choosing during laser cutting.

关 键 词：激光技术 激光加工 硅材料 热效应 温度场分布 

分 类 号：TN249[电子电信—物理电子学]