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出 处:《石河子大学学报(自然科学版)》2015年第4期487-490,共4页Journal of Shihezi University(Natural Science)
基 金:国家重点基础研究发展计划(973计划)项目(2012CB722603)
摘 要:Sonogashira反应是构建Csp2-Csp键最重要的方法之一,在医药、天然产物、有机分子材料等内炔类化合物的合成中有着广泛应用。基于前期研究成果,本文考察了不同铜盐、配体、碱以及溶剂对芳香卤代物与芳香端炔的Sonogashira偶联反应的影响,实验结果表明:在DMF中,Cu I为催化剂,N'-甲基水杨酰肼为配体,无水K2CO3作碱,在120℃下实现了多种芳香碘代物与芳基炔的Sonogashira偶联反应,产率为34%-86%。Sonogashira coupling reaction is one of the most important methods for the formation of Csp2-Csp bonds. This method has been widely used to synthesize internal acetylene compounds, such as pharmaceuticals, natural products and organic molecular materials. Based on the previous research foundation, we examine the influence of different copper salts, ligands, bases and solvents on the Sonogashira coupling reaction between the aromatic halides and aromatic terminal alkynes. The results show that the reactions of aryl iodides with aromatic alkyne in DMF could be carried out smoothly by CuI in the presence of 2-hydroxy-N'-methylbenzohydrazide and K2CO3 at 120 ℃ for 24 h, and 34%-86% yields are obtained.
关 键 词:N’-甲基水杨酰肼 铜 SONOGASHIRA反应 交叉偶联
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