晶片切割技术的应用与发展  

Application and Development of Wafer Slicing Technology

作　　者：陈超[1] 秦建新 林峰 

机构地区：[1]中国有色桂林矿产地质研究院有限公司 [2]广西超硬材料重点实验室 [3]国家特种矿物工程技术研究中心,中国桂林541004

出　　处：《超硬材料工程》2015年第4期12-16,共5页Superhard Material Engineering

摘　　要：随着半导体行业的发展,尤其是太阳能电池对大直径硅片的需求不断增加,对硅片的加工精度要求也越来越高,晶片加工技术也越来越受到重视,其中晶片切割是制约后续工序中成品率高低的重要工序。采用传统内圆锯片切割已经不能满足现有硅片大尺寸、小切缝、高质量和生产效率的要求。自由磨料多线锯切割成为当前最常用的切割方式。为了追求更高的现代化生产的高效率,固着磨料多线锯切割是快速发展起来的一种精密切割技术。文章综述了现代晶片切割技术现状,提出了晶体切割技术的发展趋势。With the development of semi-conductor industry,especially the increasing de-mand of large-diameter silicon wafer for solar cell,the requirement for machining accura-cy of silicon wafer becomes higher and the wafer processing technique receives more atten-tion than before.Among them,wafer slicing is a key process which will influence the rate of finished product during the subsequent process.The traditional diamond inner round saw cutter can not meet the needs of larger size,small kerf-loss,high quality and efficien-cy of silicon wafer slicing.The most commonly used cutting tool at present is the free ab-rasive multi-wire saw.In order to achieve higher efficiency of modern production,fixed abrasive multi-wire saw cutting technique has been rapidly developed as a precision cutting technique.Current situation of the modern wafer slicing technique has been summarized in this article and the development trend of the wafer slicing technique has been predicted.

关 键 词：金刚石线锯 晶片切割 游离磨料 固着磨料 综述 

分 类 号：TN305[电子电信—物理电子学]