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机构地区:[1]烟台大学环境与材料工程学院,山东烟台264005
出 处:《电镀与精饰》2015年第10期6-8,共3页Plating & Finishing
基 金:山东省高等学校科技计划项目(J13LA07)
摘 要:采用置换还原法制备树枝状镀银铜粉,通过扫描电镜、能谱分析以及高温氧化试验,研究了沉积过程、粉末性能以及用镀银铜粉为填充材料的导电橡胶性能。结果表明,络合剂YH-10对银离子有较强的络合作用,树枝状铜粉表面镀覆一层均匀致密的银层,电阻率达到0.0001Ω·cm,表面未见氧化物出现。在150℃保温1.5 h条件下,镀银铜粉未被氧化,表明粉末具有抗高温氧化性。制备的镀银铜粉和进口镀银铜粉为导电填料制备导电橡胶,其各项性能参数相当。In this paper,dendritic copper powder for silver plating was prepared by using displacement and reduction methods,deposition process,properties of the powder,and performance of the conductive rubber which using the copper powder for silver plating as filling material were studied through SEM,energy spectrum analysis and high-temperature oxidation test. Results showed that the complexing agent YH-10 had strong complexation on silver ions,an uniform and compact silver layer was coated on the dendritic copper powder surface,the resistivity was 0. 000 1 Ω·cm and no oxide was appeared on the surface. Under the condition of 150 ℃ and 1. 5 h heat preservation,the powder had not been oxidized,which showed that the powder had high temperature resistance. Using the prepared copper powder for silver plating and the imported copper powder for silver plating as conductive filler to prepare conductive rubber respectively,various performance parameters of the two rubbers were similar.
分 类 号:TQ153.16[化学工程—电化学工业] TB39[一般工业技术—材料科学与工程]
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