随机振动下板级组件焊点可靠性研究进展  

Research development on the reliability of board level assembly solder joint under random vibration

作　　者：刘培生[1] 刘亚鸿 杨龙龙[1] 卢颖[1] 王浩[1] 

机构地区：[1]南通大学江苏省专用集成电路设计重点试验室,江苏南通226019

出　　处：《电子元件与材料》2015年第11期5-10,共6页Electronic Components And Materials

摘　　要：针对板级组件焊点在随机振动下的可靠性问题,对与之相关的实验研究成果和仿真结果进行了综述。首先介绍了球栅阵列(BGA)封装芯片焊点失效的位置,BGA焊点的材料以及BGA参数和印制电路板(PCB)参数对焊点可靠性的分析,并介绍了疲劳寿命预测方法和子模型法、特殊结构的随机振动分析。最后,提出了随机振动情况下的BGA结构的优化方法。Aimed at the reliability of board-level assembly solder joint under random vibration, the experimental results and simulation results related to the reliability issues are summarized. Firstly, the failure position of the ball grid array （BGA） solder joint, the material of the BGA solder joint and the parameter of BGA and the parameter of printed circuit board （PCB） which influence the reliability of the solder joint are introduced. Then fatigue life prediction method and the Sub-model method, the random vibration analysis of special structure are described. Finally, the optimization method of BGA is proposed.

关 键 词：焊点 随机振动 综述 有限元分析 失效 可靠性 板级组件 

分 类 号：TN43[电子电信—微电子学与固体电子学]