金属基复合材料在微波封装领域的研究进展  

Research Progress of Metal Matrix Composites for Microwave Packaging

作　　者：周明智[1] 许业林[1] 雷党刚[1] 卢海燕[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230088

出　　处：《电子机械工程》2015年第5期1-4,34,共5页Electro-Mechanical Engineering

摘　　要：电子信息技术的发展对封装材料的性能提出了苛刻的要求。金属基复合材料具有轻质、高导热、低膨胀等优异的热物性能,是一种理想的电子封装材料。电子封装用金属基复合材料增强体含量高,因而研制困难,工程应用的技术难度大。文中综述了国内外电子封装用金属基复合材料的性能及研究现状,指出了当前复合材料在应用中的主要问题,并针对这些问题给出了建议。With the development of electronic and information technology,the performance of the electronic packaging material is becoming even more critical. The metal matrix composites（ MMCs） is an ideal electronic packaging material for its excellent thermal physical properties such as light weight,high thermal conductivity,low expansion coefficient. The MMCs is designed with high volume fraction of reinforcement for electronic packaging,which makes its manufacturing and application very difficult. In this paper the research status and application of the MMCs are summarized and the key problems in application are pointed out. The solutions to these problems are also suggested.

关 键 词：金属基复合材料 封装 研究进展 

分 类 号：TB333.1[一般工业技术—材料科学与工程]