用于PCB行业的LDI设备发展状况  

The development of LDI equipment for the PCB industry

作　　者：曲鲁杰 杜卫冲 

机构地区：[1]中山新诺科技股份有限公司,广东中山528437

出　　处：《印制电路信息》2015年第11期41-43,70,共4页Printed Circuit Information

摘　　要：PCB行业向多层、高精度的HDI板、IC-载板方向发展,在这个领域里,传统曝光机已无法满足这种技术的需求,LDI正在替代传统曝光而迅速发展起来。文章介绍了当前在PCB行业中两种主流的LDI设备的技术以及发展状况。PCB industry is developing in the direction of multi-layer, high-precision, HDI, IC Substrate.In this area, the traditional exposure has been unable to meet the needs of this technology, so LDI exposure as analternative has developed rapidly. This article describes the current technology and the development direction of thetwo mainstream LDI equipments in the PCB industry.

关 键 词：激光成像 高密度互连 印制电路板 IC-载板 

分 类 号：TN41[电子电信—微电子学与固体电子学]