一种局部厚铜HDI工艺产品开发  

Research on the partial-thick Cu HDI technology

作　　者：辜义成 张志远 袁继旺 董付勋 黎正曦 

机构地区：[1]东莞生益电子有限公司,广东东莞523127

出　　处：《印制电路信息》2015年第A01期360-371,共12页Printed Circuit Information

摘　　要：文章通过对一种局部厚铜＋HDI工艺产品进行制作研究，通过分析设计与工艺制作难点，重点对叠层结构设计、内外层图形、内层铜厚、盲孔工艺、电镀填平、局部镀厚铜工艺方法、多次电镀设计、POFV等工艺制作难点进行研究，找出了工艺难点的有效设计与解决方法；经对局部厚铜HDI板进行产品制作，成品耐热测试满足要求；验证了局部厚铜HDI工艺技术可行性；通过此项目研究，成功开发了局部厚铜HDI制作工艺技术。In this paper, We study the manufacturing technology about the partial-thick cu HDI, At first, we analyze the technical difficult issues about partial-thick cu HDI,for example the board structure design, and analyzing the figure of inner ,and the inner cu thick requirement, and etc. We do some research and evaluating about partial-thick-cu and HDI process technology, for example, designing the via hole manufacturing process technology and the partial-thick copper technology process, researching the way about plating thick-cu, and the way about through holes POFV, and the via plating flatten, etc. We test the suitable ways to solve the process difficult issues; Through producing the board of partial-thick cu HDI, we evaluate the manufacturing technology; Finally, we test the products quality. All the results meet the standard requirements; In this study, we research ＆ develop successfully the manufacturing technologies about the partial-thick cu HDI products.

关 键 词：局部厚铜高密度互连 盲孔 电镀填平 树脂塞孔后再镀覆铜 

分 类 号：TN41[电子电信—微电子学与固体电子学]