导电片状镍粉/聚酰亚胺复合薄膜的制备与性能研究  

Preparation and Properties of Conductive Flake Nickel Powder/Polyimide Composite Film

作　　者：杨莹[1] 严辉[2] 李桢林[2] 张雪平[2] 范和平[1,2] 

机构地区：[1]江汉大学光电化学材料与器件省部共建教育部重点实验室柔性显示材料与技术湖北省协同创新中心,武汉430056 [2]华烁科技股份有限公司,武汉430074

出　　处：《绝缘材料》2015年第11期14-17,共4页Insulating Materials

基　　金：国家高技术研究发展计划(863计划)(2015AA033406)

摘　　要：采用原位聚合法合成了导电片状镍粉/聚酰胺(CFNP/PAA)溶液,通过热亚胺化制备了CFNP/PI复合薄膜,对复合薄膜的红外光谱、热性能、力学性能、电性能、表面形貌进行了分析。结果表明:CFNP的加入不影响复合薄膜的亚胺化,随着CFNP含量的增加,CFNP/PI复合薄膜的电气强度和体积电阻率下降,导电能力明显提高,热稳定性提高,力学性能有所下降。当CFNP质量分数为21.5%时,复合薄膜的体积电阻率下降至85Ω·m,达到渗流阈值。A conductive flake nickel powder/polyamide （CFNP/PAA） solution was synthesized by in-situ polymerization method, and a CFNP/PI composite film was prepared by thermal imidization. The FTIR spectrum, thermal property, mechanical properties, electrical properties, and surface morphology of the composite film were analyzed. The results show that the addition of CFNP has no impact on the imidization of CFNP/PI composite film. With the increase of CFNP content, the volume resistivity and breakdown strength of the CFNP/PI composite film decrease, so the conductive ability is improved significantly. The thermal stability is improved, while the mechanical properties decline slightly. When the mass fraction of CFNP is 21.5%, the volume resistivity of the composite film decreases to 85 Ω·m, reaching the percolation threshold.

关 键 词：导电片状镍粉 聚酰亚胺 复合材料 体积电阻率 

分 类 号：TM215.3[一般工业技术—材料科学与工程]