电镀电流对镀镍金刚石性能的影响  

Effect of current on the property of electroplated diamond

作　　者：方莉俐[1] 薛丽沙 

机构地区：[1]中原工学院,郑州450007

出　　处：《金刚石与磨料磨具工程》2015年第5期38-42,54,共6页Diamond & Abrasives Engineering

基　　金：河南省教育厅科学技术研究重点项目(编号:14A140024)

摘　　要：为研究电镀电流对金刚石表面镀镍层沉积速率的影响,采用电沉积法对金刚石表面镀镍,并观察镀层的表面形貌,同时分析了电镀电流对镀镍金刚石镀镍层致密度、冲击韧性和抗压强度的影响。实验结果表明:当电镀电流从2A升至6A,随着电流增大,金刚石的镀镍层镀速、冲击韧性和抗压强度均随之增大,并在6A时达到最大;镀覆金刚石表面镀层均匀,且漏镀现象减少;电镀电流影响镀液温度,而镀液温度决定了镀层的致密度。电镀液温度处于50℃时,镀镍层显微应变最小,镀层的致密度达到最大。Electrodeposition method was used to plate the surface of diamond with nickel . The effects of electroplating current on deposition rate of nickel plating on diamond surface , nickel plating layer density and impact toughness were discussed . The surface morphology of nickel coating was observed , and the compressive strength of nickel plated diamond was also discussed . The experimental results demonstrated that when plating current rose from 2 A to 6 A , the diamond′s nickel plating rate , impact toughness and compressive strength all increased as the current rose , and reached their maximum value at current of 6 A . The diamond surface coating became more uniform and the plating leakage reduced . Electroplating current could affect the bath temperature , which determined coating density . The microscopic strain of nickel plating layer was smallest and coating density achieved its maximum when the bath temperature was 50 ℃ .

关 键 词：电流 金刚石 电镀镍 

分 类 号：TQ164[化学工程—高温制品工业]