键合Cu线无卤直接镀Pd工艺及性能研究  

Investigation of copper direct coating Pd technology and bonding properties

作　　者：曹军[1] 范俊玲[2] 高文斌[1] 

机构地区：[1]河南理工大学机械与动力工程学院,河南焦作454000 [2]焦作大学化工与环境工程学院,河南焦作454003

出　　处：《材料科学与工艺》2015年第5期110-114,共5页Materials Science and Technology

基　　金：河南省科技攻关项目(2GSO64-A52-05)

摘　　要：利用扫描电镜、聚焦离子束、强度测试仪研究了键合铜线无卤直接镀钯工艺及不同模具孔径对镀钯键合铜线表面质量、镀层厚度的影响规律,分析了钯层均匀性对键合性能的影响机理.研究结果表明：无卤直接镀钯工艺可获得镀层均匀的镀钯键合铜线;直接镀模具孔径大于被镀铜线直径3～4μm时,镀钯铜线镀层均匀且表面光洁;镀钯铜线钯层不均匀会造成Electronic-Flame-Off（EFO）过程中的Free Air Ball（FAB）偏球缺陷,进而降低焊点力学性能;直接镀钯键合铜线镀层均匀,避免了Free Air Ball（FAB）偏球缺陷,焊点球剪切力≥15 g、球拉力≥8 g,呈非离散分布,满足工业化要求.The copper bonding wire direct coating Pd process and direct coated Pd copper bonding wire surfaces,Pd thickness with different diameters dies were investigated by scan electronic microscopy,focused ion beam and tensile strength tester,and the effects of Pd thickness were discussed. It was found that Pd thickness was uniform after direct coating Pd. The surface of direct coated Pd copper bonding wire is bright and uniform when die diameters bigger 3 ～ 4 μm than copper bonding wire. Non-uniform Pd thickness on copper bonding wire can cause Golf ball,then resulting in insufficient bonding strength. For direct coated Pd copper bonding wire,Pd thickness on copper bonding wire is uniform,then avoiding Free Air Ball defects,ball shear strength is over 15 g,and pull force is over 8 g,the distribution is not discrete,and direct coated Pd copper bonding wire can meet the industrial requirements.

关 键 词：直接镀钯 模具 镀层厚度 键合 

分 类 号：TG249.7[金属学及工艺—铸造]