纯相位硅基液晶器件的芯片级封装技术  

Fundamentals of Die-Level Assembly Techniques for Phase-Only Liquid Crystal on Silicon Devices

作　　者：张紫辰[1] 尤政[1] 

机构地区：[1]清华大学精密仪器系,精密测试技术及仪器国家重点实验室,微纳制造器件与系统协同创新中心,北京100084

出　　处：《电子学报》2015年第11期2322-2330,共9页Acta Electronica Sinica

基　　金：博士后基金(No.2013M530613);清华大学自主科研项目(No.20121087915)

摘　　要：本文讨论了纯相位硅基液晶器件(liquid crystal on silicon device,LCOS)的芯片级封装技术.包括具体基础工艺介绍、关键工艺分析及封装检测、质量控制方法等.其中详细介绍了工艺步骤中的玻璃基板和硅基板的光学预先检测、基板清洗、取向层处理、胶水涂覆、组装封装及灌注液晶工艺.同时在密封胶水涂覆、灌注液晶及如何控制器件厚度的原则问题上做出了重点阐述,最后定义了优质封装质量的纯相位硅基液晶器件应该具备的基本要素.This paper describes fundamentals of die-level assembly techniques for phase-only liquid crystal on silicon（ LCOS） devices,which have not been in-depth discussed previously. The discussion contains the introduction to the basic assembly process,analysis to key assembly procedures,inspection to the assembled device and overall quality control including pre-assembly inspection and cleaning process for both glass and silicon backplane,alignment layer deposition with baking process,glue line processing,assembly and liquid crystal filling process. In particular,glue line writing,liquid crystal filling and overall quality assessment of assembly process have been substantially investigated. Finally,the excellent quality of assembled phase-only LCOS devices with characteristics have been defined.

关 键 词：硅基液晶器件 封装工艺 光学检测 液晶灌注 取向层处理 

分 类 号：TN305[电子电信—物理电子学]