微细铜粉镀覆银的制备工艺及性能研究  

Study on preparation and properties of silver-coated fine copper powders

作　　者：李文良[1] 彭程[1] 叶章根[1] 罗远辉[1] 赵奇金[1] 

机构地区：[1]北京有色金属研究总院稀有金属冶金材料研究所,北京100088

出　　处：《电镀与涂饰》2015年第21期1205-1210,共6页Electroplating & Finishing

基　　金：北京有色金属研究总院青年基金资助项目(53107(2011))

摘　　要：以硝酸银为主盐、葡萄糖为还原剂,通过化学镀方法制备了银包铜复合粉体。通过能谱(EDS)分析了敏化和活化后铜粉表面沉积的颗粒的组成,采用扫描电镜(SEM)和高温增重率测量等方法研究了主盐和还原剂质量浓度、pH以及镀覆时间对银包铜粉表面形貌与高温抗氧化性的影响,获得了适宜的化学镀银工艺:AgNO_3质量浓度20 g/L,葡萄糖质量浓度30 g/L,p H 11,镀覆时间40 min。不同银含量的铜粉的热重(TG)分析表明,银含量越高的粉体,其抗氧化性也越好。化学镀初期,生成的银颗粒较少,镀层呈岛状结构;随着反应的继续,银颗粒大量产生,岛状组织延伸生长,形成多镀层重叠结构。Silver-coated copper composite powders were prepared with silver nitrate as main salt and glucose as reducing agent by electroless plating. The compositions of the particles deposited on the surface of copper powders after sensitization and activation were analyzed by energy-dispersive spectroscopy （EDS）. The influence of mass concentrations of silver salt and reducing agent, pH value, and plating time on the surface morphology and high-temperature oxidation resistance of the silver-coated copper powders were characterized by scanning electron microscopy （SEM） and measurement of weight gain rate at high temperature. The suitable electroless silver plating process was obtained as follows： AgNO3 20 g/L, glucose 30 g/L, pH 11, and plating time 40 min. The thermogravimetric （TG） analysis for silver-coated copper powders with different contents of silver indicates that the powders with higher content of silver has better oxidation resistance. In early period of electroless plating, only a few silver particles are produced, and the deposit presents an island-shaped structure; with continuation of the reaction, massive silver particles are produced and the deposit extends and grows to form a multi-layer overlapping structure.

关 键 词：铜粉 化学镀银 硝酸银 葡萄糖 抗氧化性 

分 类 号：TQ153.16[化学工程—电化学工业]