基于有限元法的微测辐射热计热电性能研究  

Research on Thermoelectricity Properties of Microbolometer Based on Finite Element Analysis

作　　者：陈超[1] 蒋亚东[1] 马加锋 

机构地区：[1]电子科技大学光电信息学院光电探测与传感集成教育部重点实验室,成都610054

出　　处：《半导体光电》2015年第5期689-692,共4页Semiconductor Optoelectronics

基　　金：国家自然科学基金项目(61235006;61421002)

摘　　要：采用有限元法针对微测辐射热计的热电耦合敏感机理进行研究。建立微测辐射热计精确三维有限元模型,采用动态热电有限元方法对器件的热电特性进行了分析,得到了其热电耦合场下的温度响应特性,并获取其热容、有效热时间常数和有效热导值等热学参数;采用该方法在微测辐射热计的设计阶段中,即可初步预判器件性能并为器件制备提供可靠的参考。所设计结构经流片验证,性能良好,且满足60Hz帧频成像要求。Thermoelectricity field-coupling theory of microbolometer was studied by finite element analysis（FEA）.Three-dimensional model of VO2 microbolometer was estabilished.Dymantic thermoelectricity field-coupling FEA method was used to analyse the thermoelectric properties.The thermal capacity,effective thermal conductivity and effective thermal time constant of the model were obtained.Performance of microbolometer can be estimated and reliable reference can be offered during the earlier design stage by using this method.A 320×240uncooled infrared focal plane with the pixel of 37μm was fabricated based on this design,presenting agood performance under the frame rate of 60 Hz.

关 键 词：微测辐射热计 有限元分析 热导 热时间常数 热电耦合场分析 

分 类 号：TN215[电子电信—物理电子学]