多颗粒LED封装警示灯热特性数值与实验研究  

Numerical and experimental investigation on thermal performance of caution light with multichips LEDs

作　　者：张立强[1] 虞莉佳 李俊超[1] 刘乔亚 王超[1] 

机构地区：[1]江苏大学机械程学院微电子先进制造及其可靠性研究所,江苏镇江212013

出　　处：《电子元件与材料》2015年第12期89-92,共4页Electronic Components And Materials

基　　金：江苏省自然基金青年基金项目(No.BK20130537);江苏大学高级人才启动基金项目资助(No.13JDG020);江苏省博士后基金项目资助(No.14002168C)

摘　　要：针对一款新型LED旋转警示车灯,选取了三个不同的关键参数(灯柱半径r,散热底座半径R及散热底座高度H),基于有限元理论及热电偶测量法,研究了多颗粒LED封装灯具结构的热特性。结果表明:最高温度点处于LED颗粒的中心处,最高温度可达67.31℃(仿真时),64.95℃(实验时)。散热底座半径对结构的最高温度影响最大。可以通过散热底座的设计来提高LED颗粒的热可靠性及车灯的使用寿命;亦为LED灯具结构设计提供了设计基础。The thermal reliability was investigated based on finite dement and thermocouple experimental methods by choosing three different parameters （the radius of the lamp r; the radius of the heat dissipation base R; and the height of the heat dissipation base H） according to a new type of rotating caution light with multichips LEDs. The results show that the highest temperature always appears on the LED chip center, which is 67.31 ~C in simulation and 64.95 ~C in experiment. The R is the most important designing parameter which affects the highest temperature. It indicates that the thermal reliability of LED packages and the using life of the light can be improved by the designing of radius of the heat dissipation base. It also provides the theoretieal value for LED light design.

关 键 词：LED 封装 车灯 可靠性 有限元法 热设计 热电偶 

分 类 号：TN312[电子电信—物理电子学]