无机填料对高分子固体电解质与金属铝键合性能的影响  

Effect of inorganic fillers on properties of polymer solid elec-trolyte and metal aluminum bonding

作　　者：阴旭[1] 刘翠荣[1] 杜超[1] 吴常雄 

机构地区：[1]太原科技大学材料学院,太原030024

出　　处：《焊接学报》2015年第11期37-40,114-115,共4页Transactions of The China Welding Institution

基　　金：国家自然科学基金资助项目(51275332)

摘　　要：阳极键合技术是一种在MEMS封装技术中常用的一种方法,目前仅可实现玻璃与金属、玻璃与半导体材料的键合;试验采用聚氧乙烯(PEO)为基质,复配少量纳米无机填料,制备出新型的固态复合聚合物电解质作为新的阳极键合材料,通过采用DSC和XRD等分析手段研究PEO与无机填料的相互作用及导电机制,进而探讨聚合物固体电解质作为新型的封装材料在阳极键合应用中的可行性.结果表明,无机填料的加入有效的抑制了PEO的结晶,使得键合界面过渡层明显,键合质量良好.Anodic bonding technology is a common method in MEMS packaging technology. Currently only glass and met-al,the glass and semiconductor materials bonding can by realized. Test using the PEO as matrix,compound with a small amount of nano inorganic filler,the preparation of a new type of solid composite polymer electrolyte as a new anodic bonding materials,by means of DSC and XRD analysis means to study the interaction of PEO and inorganic filler and conductive mechanism,and then discusses the polymer solid electrolyte as a new type of packaging materials in the feasibility in application of anodic bonding,The results show that the addition of PEO can effectively inhibit the crystallization of PEO,and the bonding quality is good.

关 键 词：无机填料 阳极键合 固体电解质 离子导电 

分 类 号：TG457[金属学及工艺—焊接]