倒装芯片封装可靠性评价方法  

Research on Reliability Evaluation of Flip-Chip Package

作　　者：张永华[1] 邬宁彪[1] 李小明[1] 

机构地区：[1]江南计算技术研究所,江苏无锡214083

出　　处：《电子工艺技术》2015年第6期347-350,357,共5页Electronics Process Technology

摘　　要：日益增长的国产高端信息电子产品促进了国内自主研发芯片的广泛应用,这使得其可靠性评价技术也变得更为迫切。基于倒装芯片的工艺流程和封装结构特点,阐述了自主研发芯片目前面临的可靠性突出问题,并结合当前芯片制造商的生产能力和相关技术标准,提出了基于温度、湿度和机械等环境应力的可靠性试验方法,最后,比较详尽的分析了各种评价测试方法能够暴露的可靠性问题及其评价标准。With widespread use of domestic electronic products has promoted the application of domestic independent chips. Therefore, the reliability evaluation of them is becoming more urgent. Based on the process and structure characteristics of flip-chip package, the outstanding issues of its reliability were described. And combined with the ability of IC manufactures and relevant standards, a series of reliability test methods which involved temperature stress, humidity stress and mechanical stress were put forward. Finally, the reliability evaluation methods and their evaluation criteria were analyzed in detail.

关 键 词：倒装芯片 封装基板 可靠性 

分 类 号：TN60[电子电信—电路与系统]