微波组件化学镀镍层焊接工艺研究  

Soldering Technology of Microwave Module With Chemical Nickel Plating

作　　者：崔洪波[1] 陈梁[1] 郭倩[1] 

机构地区：[1]中国电子科技集团公司第五十五研究所,江苏南京210016

出　　处：《电子工艺技术》2015年第6期351-353,366,共4页Electronics Process Technology

摘　　要：铝合金壳体镀金的高成本及"金脆"效应,镀银层的不稳定给微波组件生产开发带来了困难。铝上化学镀Ni-P合金,具有厚度均匀、镀层稳定和耐指纹特性,成本低廉,在电子工业中特别适宜结构形状复杂(含深孔、盲孔、凹槽)的电子元件镀覆。实现镀镍层上元件的良好焊接,确保微波元件的高可靠,同时降低成本,缩短开发周期,具有非常重要的意义。The research and application of microwave module become more and more difficult due to the high cost gold embrittlement and instability of aluminum alloy with silver coating. Aluminum with Ni-P alloy coating having good behaviors of uniform thickness stable coating fingerprint resistance, and low cost, is specifically suitable for electronic products with complex construction such as deep hole, blind hole and fillister in electronic industry. This has great significance to realize well soldering on nickel coating, ensure high reliability of microwave component, reduce production cost, and abbreviate development cycle.

关 键 词：微波组件 化学镀镍 焊接 高可靠性 

分 类 号：TN605[电子电信—电路与系统]