化学镀钯工艺及镀层性能研究  

Palladium Plating Electroless and Performance

作　　者：李伟[1] 王钰蓉[1] 王文昌[1] 陈智栋[1] 

机构地区：[1]常州大学石油化工学院,江苏常州213164

出　　处：《电镀与精饰》2015年第12期9-14,共6页Plating & Finishing

摘　　要：利用在酸性镀钯液中进行化学镀的方法,在Ni-P合金基底上获得了性能优异的钯镀层。通过研究镀液参数对钯沉积速度、镀层外观及表面形貌的影响,确定最佳工艺条件为1.0g/L PdCl_2、20g/L三乙醇胺、8g/L柠檬酸铵、θ为65℃、pH 2.0。并对在最佳工艺条件下得到的镀层进行了耐蚀性、可焊性的测试。研究表明,镀层具有优异的可焊性、耐蚀性。Palladium（Pd） coating was obtained by electroless plating in acidic solution on the substrate of Ni-P coating which showed outstanding performance.The effects of plating solution parameters on deposition rate,appearance and morphology of the coatings were studied.The optimum conditions were determined as 1.0g/L PdCl_2,20g/L triethanolamine,8g/L ammonium citrate,65°C,pH 2.0.The corrosion resistance and solderability were also tested.Pd coatings showed excellent properties in solderability and corrosion resistance.

关 键 词：化学镀 钯镀层 可焊性 耐蚀性 

分 类 号：TQ153.19[化学工程—电化学工业]