无机粉体及其表面改性对有机硅电子灌封料阻燃性、电性能和力学性能影响  

Research on the Influence of Powder and Its Surface Modification to the Flame Retardance,Electric Performance and Mechanical Properties of Silicone Potting Material

作　　者：叶贤春 贺建芸 康维佳[2] 何红[2] 苑会林 

机构地区：[1]厦门北化生物产业研究院有限公司,福建厦门361022 [2]北京化工大学,北京100029

出　　处：《合成材料老化与应用》2015年第6期12-15,共4页Synthetic Materials Aging and Application

摘　　要：以有机硅树脂为基料、复合粉体为填料,制备有机硅电子灌封料,采用硅烷偶联剂(KH-570)γ-甲基丙烯酰氧基丙基三甲氧基硅烷对粉体进行表面处理,研究了粉体种类及其表面改性及用量对有机硅电子灌封料的阻燃性、电学性能和力学性能的影响。研制的有机硅电子灌封料具有良好的阻燃性、电性能和力学性能,可用于较高电压等级的产品,满足避雷器的电气性能要求。Organic silicone resin and composite powders were respectively used as base material and filler to prepare silicone electronic potting compound,and silane coupling agent（ KH- 570） γ- 3-（ trimethoxysilyl） propyl methacrylate was used to do surface treatment of the powder. The influence of surface modification and content of the powder to the flame retardance,electric performance and mechanical properties of silicone potting material was studied in this paper. The developed organic silicon electronic potting materials with good flame retardance,electric performance and mechanical properties,could be used in high voltage grade of products,and meet the electrical performance requirements of arrester.

关 键 词：复合粉体 表面改性 电子灌封料 绝缘性 电气性能 

分 类 号：TQ333.93[化学工程—橡胶工业]