金刚石、碳化硅复合热传导材料的发展  

Development of diamond and Si C composited heat sink materials

作　　者：王艳辉[1] 成晓哲[1] 臧建兵[1] 

机构地区：[1]燕山大学材料科学与工程学院,河北秦皇岛066004

出　　处：《燕山大学学报》2015年第5期390-402,共13页Journal of Yanshan University

基　　金：河北省自然科学基金资助项目(14961106D)

摘　　要：金刚石或碳化硅增强的金属基或陶瓷基复合热传导材料理论上具有高的热导率、低的热膨胀系数,然而金刚石或者碳化硅与基体的界面结合问题严重降低了复合热传导材料的热导率。通过改善烧结工艺、添加碳化物形成元素、增强相表面镀铜等方法来解决问题,虽取得一定效果,但并未完全解决界面问题。本文介绍了两种更为有效的解决手段,在金属基复合材料中,通过在增强相表面镀覆碳化物金属镀层的方法改善界面结合问题;在陶瓷基复合材料中,采用添加活性添加剂以及在增强相表面镀覆障碍层的办法解决陶瓷基复合热传导材料中的氧化问题。Metal or ceramic based diamond（ or Si C） heat sink composites have, theoretically, high thermal conductivity and low thermal expansion coefficient. However,the interfacial bonding between the matrix and diamond or Si C particles usually causes the reduction of the thermal conductivity of the heat sink composites. A series of means have been used to improve the thermal conductivity by changing the sintering process,adding carbide forming elements,depositing Cu on diamond or Si C. Although these methods show certain success,the interfacial problem has not been completely solved. In recent years,our group developed some effective solutions to the problems. For the metal based composites,carbide forming metals are deposited on diamond or Si C to improve the interfacial bonding strength between the particles and metal base,while for the ceramic based composites,active additions and protective coatings are employed to prevent the oxidation of Si C in ceramic base.

关 键 词：复合热传导材料 金刚石 碳化硅 铜 硼玻璃 热导率 热膨胀系数 

分 类 号：TB331[一般工业技术—材料科学与工程]