多层金属电源线地线网络拓扑结构的IR-drop分析方法  

A Technique for IR-Drop Analysis of the Multilayered Power/Ground Networks

作　　者：王一[1,2] 杨海钢[1] 余乐[1,2] 孙嘉斌[1] 

机构地区：[1]中国科学院电子学研究所可编程芯片与系统研究室,北京100190 [2]中国科学院大学,北京100049

出　　处：《电子学报》2015年第12期2542-2546,共5页Acta Electronica Sinica

基　　金：国家自然科学基金(No.61271149)

摘　　要：提出了一种电源/地线(P/G)网络压降(IR-drop)静态分析方法.该方法探索了多层金属立体P/G网络结构,通过输入各金属层的坐标和通孔(Via)的工艺规则,分析不同多层金属P/G网络的拓扑结构对IR-drop的影响.实验结果表明,文中方法的压降评估结果与SPICE仿真结果相比有着高度的一致性,平均误差小于0.4%,且算法时间复杂度与通孔数目成线性关系.并且指出中间层金属的拓扑结构对IR-drop的分布和大小有重要影响.This paper presents a method for DC analysis of IR-drop in power/ground（P/G） networks.The proposed method explores three-dimensional structure of multi-layer P/G grids.By inputting the coordinates of each metal layer and the process rules of vias.the proposed method analyzes the impact of different multi-layers P/G grids on IR-drop.Experimental results demonstrate that the method has high consistency with SPICE simulation results.The relative error is less than 0.4% and the time complexity has the linear relation to the number of vias.Moreover,the topology of inter-layers has an important relation to the value and distributions of IR-drop.

关 键 词：电源/地线网络 多层 压降 通孔 

分 类 号：TP391[自动化与计算机技术—计算机应用技术]