陶瓷金属封接过程中钎料润湿特性的数值研究  

Numerical investigation of solder wetting in the bonding of ceramic and metal

作　　者：钟伟[1] 张国亮[1] 彭家根[1] 

机构地区：[1]中国工程物理研究院电子工程研究所,四川绵阳621900

出　　处：《焊接技术》2016年第1期10-13,1,共4页Welding Technology

基　　金：国家自然科学基金资助项目(11205136);中国工程物理研究院电子工程研究所科技创新基金项目(S20140806)

摘　　要：针对陶瓷金属封接过程中钎焊钎料的润湿特性开展数值研究,建立纯银钎料润湿流动过程的自由界面追踪模型。模型采用随温度变化的动态物性参数,考虑液固传热、相变潜热、表面张力等因素,利用enthalpy-porosity方法处理钎料熔化凝固问题。模型利用流体体积法(VOF)解决相界面追踪问题,求解得到钎料形态随加热时间变化的动态结果,计算得自由液面与固壁间夹角α,β,并与同一条件下开展的钎焊试验结果进行对比,两者吻合良好。Aiming at the properties of solder wetting in the bonding of ceramic and metal, numerical investigation was conducted. The free surface tracking model of Ag solder wetting was built. The model adopted the temperaturedependent material parameters and introduced the enthalpy-porosity method into solder's melting and solidification,considering the liquid-solid transferring heat, melting heat and surface tension. Volume of Fraction( VOF) was applied to the problem of phase interface tracking, which resulted in the time-dependent results of solder's configuration. The angles α, β between phase interface and wall were calculated, which compared well with the experimental results under the same condition.

关 键 词：陶瓷金属封接 钎焊 润湿 VOF 数值模拟 

分 类 号：TG425[金属学及工艺—焊接]