半导体激光器结温的测试及分析（英文）  

Measurement and Analysis of Junction Temperature of Semiconductor Laser Devices

作　　者：杨扬[1,2] 于果蕾[1,2] 李沛旭 夏伟 徐现刚[1,2] 

机构地区：[1]山东大学晶体材料国家重点实验室,山东济南250100 [2]山东华光光电子有限公司,山东济南250100

出　　处：《激光与光电子学进展》2016年第1期157-163,共7页Laser & Optoelectronics Progress

基　　金：国家973计划(2013CB632801)

摘　　要：结温/热阻是反映激光器器件散热能力的综合参数,与封装焊料层的烧结质量关系密切。本文分别通过正向电压法和波长漂移法,测试计算得到激光器的工作结温,利用扫描声学显微镜分析了激光器焊料层中空洞分布;验证了结温测试方法的可行性,并确认了激光器结温与焊料层烧结质量之间的对应关系,相关结果将指导半导体激光器的研制改进和器件分筛。Junction temperature/thermal- resistance is reflected in the comprehensive cooling capacity of laser devices, which is closely related to the sintering quality of the solder layer. The operating junction temperatures of laser devices have been detected by the forward-voltage and wavelength-shift methods. The distribution of voids in the solder layer have been analyzed using a scanning acoustic microscope. The results verify the feasibility of junction temperature measurement, and confirm the relation between the junction temperature and the sintering quality of laser chips. These results will pave the way for the development of semiconductor lasers and the filtering of laser devices.

关 键 词：激光器 结温 热阻 扫描声学显微镜 

分 类 号：TN248[电子电信—物理电子学]