电子封装用金属基复合材料的研究进展  

Research and development of metal matrix composites for electronic packaging

作　　者：曾婧[1] 彭超群[1] 王日初[1] 王小锋[1] 

机构地区：[1]中南大学材料科学与工程学院,长沙410083

出　　处：《中国有色金属学报》2015年第12期3255-3270,共16页The Chinese Journal of Nonferrous Metals

基　　金：国家军品配套项目(JPPT-125-GJGG-014-01b);湖南省知识产权战略实施立项项目(2013C信警007)

摘　　要：金属基复合材料凭借其优异的性能以及较成熟的制备工艺,成为电子封装领域研究的重要方向之一。综述典型的电子封装用金属基复合材料的研究现状,阐述金属基复合材料的热物理性能设计,列举铝基、铜基电子封装复合材料热物理性能的影响因素和改进措施,介绍常见的制备方法,最后对金属基电子封装材料的发展趋势进行展望。The metal matrix composites（MMCs） is one of the important directions on the research of electronic packaging due to their excellent properties and increasingly mature manufacturing methods.The progress in the research on typical MMCs for electronic packaging was reviewed.The thermo-physical properties design,the key factors controlling the thermo-physical properties of Al-matrix and Cu-matrix composites,the improvement measures and the common manufacturing methods were discussed.The prospects for the future development of MMCs for electronic packaging were given at the end.

关 键 词：电子封装 金属基复合材料 热导率 热膨胀系数 

分 类 号：TB333[一般工业技术—材料科学与工程]