高强度高电导铜银材料的研究进展  

Advances on High Strength and High Conductivity Cu-Ag Materials

作　　者：梁明[1] 焦高峰[1] 徐晓燕[1] 王鹏飞[1] 李成山[1] 张平祥[1] 

机构地区：[1]西北有色金属研究院,陕西西安710016

出　　处：《稀有金属材料与工程》2016年第1期248-253,共6页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(51031002)

摘　　要：高强度高电导铜银材料是一种具有优良物理性能和力学性能的结构材料。本文从材料的组织结构、强化机理、电导特性以及极塑性变形技术制备超细晶铜银材料等方面综述了材料的主要研究进展,并揭示了未来可能的研究方向。High strength and high conductivity Cu-Ag material is a kind of structural material with excellent physical properties and mechanical properties. In this paper, the developments of the materials were introduced, including microstructure, strengthening mechanism, conductivity characteristics and Cu-Ag UFG（ultra-fine grained） materials by severe plastic deformation. Moreover, the possible research directions in the future were revealed.

关 键 词：CU-AG 高强度 高电导 极塑性变形 

分 类 号：TG146.11[一般工业技术—材料科学与工程]