运用电子背散射衍射技术研究高纯金溅射靶材的微观组织与织构  

Microstructureand Texture Investigation of Sputtering Target Materials of High Purity Gold by EBSD

作　　者：朱勇 阳岸恒 张济祥 谢宏潮 卢绍平 

机构地区：[1]贵研铂业股份有限公司,昆明650106

出　　处：《有色金属工程》2016年第1期5-8,共4页Nonferrous Metals Engineering

基　　金："十二五"国家科技支撑计划项目(2012BAE06B05)

摘　　要：电子背散射衍射(EBSD)技术是分析高纯金靶材微观组织的有效手段,可以快速高效地定量统计材料的微观组织结构、织构、晶粒尺寸、取向差。运用电子背散射衍射技术,研究通过优化真空熔炼工艺制备的高纯金溅射靶材不同区域的微观组织、晶界取向差和织构。结果表明,高纯金靶材组织由细小的等轴晶组成,平均晶粒尺寸为206 nm,样品在轧制过程中发生再结晶,样品所测得的织构(110)平行于轧面,轧向不确定,为较弱的织构。The electron backscatter diffraction （EBSD） technology is any effectively analysis tools for gold target microstructure, by it can fast and efficiently quantitatively statistically analyze the texture, the grain size and the orientation difference of the materials. The microstructure of different regions, grain boundary orientation and texture components of the high purity gold sputtering target prepared by optimizing vacuum melting are investigated by using the electron backseatter diffraction （EBSD） technology. The results show that the tissue of the high purity gold target is composed of the fine equiaxed grains, and the average grain size is 206 nm, and there is the recrystallization occurred in the sample during the rolling process. The measured sample texture （110） parallel to the roiling surface, the rolling orientation is uncertain, and it is a weaker texture.

关 键 词：高纯金 溅射靶材 电子背散射衍射 取向差 织构 

分 类 号：TG115.23[金属学及工艺—物理冶金] TG146.31[金属学及工艺—金属学]