发光二极管用封装材料的研究进展  

Progress in packaging material for light emitting diode

作　　者：李光[1] 冯亚凯[1,2,3] 谭晓华 孙绪筠 霍钜 

机构地区：[1]天津大学化工学院,天津300072 [2]天津化学化工协同创新中心,天津300072 [3]天津德高化成电子材料有限公司,天津300451

出　　处：《化工新型材料》2016年第1期28-30,共3页New Chemical Materials

摘　　要：发光二极管(LED)能将电能高效转化为光能,在照明领域的应用得到了迅速发展,对LED封装材料的要求也越来越高。普通环氧树脂在耐紫外辐射、耐热老化性能方面的缺陷限制了其作为封装材料的发展;有机硅的"杂化分子"结构使材料有稳定的光学性能、可调的力学性能和优异的整体性能,因此有机硅材料在LED封装领域发展前景广阔,吸引了越来越多科研人员的关注。另外,为满足不断发展的LED封装的要求,需要对有机硅进行改性。Light-emitting diodes（LEDs）could effectively convert electricity into light.With the rapid development of LEDs in the lighting market,there are increasing requirements for packaging materials.Recently,common epoxy resin has been limited to use as packaging materials because of its poor resistance to UV and heat aging.However,the structure of＂hybrid molecule＂gives organic silicone materials stable optical properties,tunable mechanical properties and excellent overall performance.In the future,organic silicone material would be widely used in the field of LED packaging,which has attracted considerable research attention.Meanwhile,organic silicone materials also need modification to meet the growing requirements for LED packaging.

关 键 词：发光二极管 封装材料 环氧树脂 有机硅 

分 类 号：TN312.8[电子电信—物理电子学]