PCBA焊点焊接不良的研究  

Research on Poor Solder Joint of PCBA

作　　者：吴红[1] 

机构地区：[1]中航工业航空动力控制系统研究所,江苏无锡214063

出　　处：《电子工艺技术》2016年第1期24-27,共4页Electronics Process Technology

摘　　要：介绍了PCBA焊点焊接不良的表现形式以及机理,通过故障树分析物料问题、设计问题、工艺问题和操作问题等四大类根本原因,结合本所产品发生的实际案例,阐述了每个大类中具体的原因,如器件可焊性、镀层、共面性问题、CTE不匹配、布局不合理、温度曲线和工艺流程不合理导致的焊接不良,着重对非工艺的原因进行了逐一的分析、试验验证,并给出了采取的对应措施,为逐步降低PCBA焊点不良率累积技术迭代的工程数据。Describe the appearance and mechanism of PCBA poor solder joint, use the fault tree tools to analyze four kinds of reasons about material, design, process and handling. Combine practice example of our product, expatiate the reasons of every kind in detail including solderability, plating, coplanarity, CTE, layout, temperature curve and process. Analyze, test and verify the reason of non-process take appropriate measure accumulate the engineering data for reducing the defect of PCBA solder joint.

关 键 词：焊接不良 塑性状态 金属间化合物 故障树分析 可焊性 

分 类 号：TN605[电子电信—电路与系统]