半导体激光钎焊SnAgCuCe无铅焊点组织与性能  

Microstructures and Properties of SnAgCuCe Solder Joints with Diode-laser Soldering

作　　者：张亮 韩继光[1] 郭永环[1] 何成文[1] 

机构地区：[1]江苏师范大学机电工程学院,江苏徐州221116 [2]美国加州大学洛杉矶分校材料科学与工程系,加利福尼亚州洛杉矶ca90095

出　　处：《稀土》2015年第6期91-95,共5页Chinese Rare Earths

基　　金：江苏省自然科学基金(BK2012144);江苏省高校自然科学基金(12KJB460005);江苏科技大学先进焊接技术省级重点实验室开放研究基金(JSAWS-11-03);江苏师范大学自然科学基金(11XLR16)资助项目

摘　　要：采用半导体激光软钎焊和红外再流焊对QFP256和0805片式电阻进行钎焊试验,研究了SnAgCuCe焊点的力学性能、热疲劳寿命以及显微组织。结果表明,在激光再流焊条件下,激光输出功率对SnAgCuCe焊点的力学性能存在显著影响,且存在最佳值。在热循环载荷作用下,随着热循环次数的增加两种焊接方式下焊点的力学性能均呈明显下降趋势,SnAgCuCe激光再流焊焊点的疲劳寿命明显高于SnAgCuCe红外再流焊焊点,主要是因为激光快热/快冷导致焊点内部物相尺寸较小,组织明显细化。Welding experiments for QFP256 and 0805 rectangular chip resistor components were carried out by diode la- ser soldering system and IR reflow soldering method, respectively, the mechanical properties, thermal fatigue life and micro- structures of SnAgCuCe solder joints were investigated. The results show that the mechanical properties of solder joints is influ- enced remarkably by laser output powers, and there is an optimal output power according to the best mechanical properties. During thermal cycling testing, the mechanical properties decrease gradually with the increasing of thermal cycling loading, the fatigue life of solder joints with laser soldering is higher than that of IR solder joints, which attributes to the rapid heating/cool- ing results in the small phases and refined microstructure.

关 键 词：激光再流焊 无铅焊点 激光功率 疲劳寿命 

分 类 号：TG454[金属学及工艺—焊接]