纯钛表面镀铜工艺的对比研究  

Comparison Research on Copper Plating Methods for Pure Titanium

作　　者：罗锦洁[1] 纪安平[1] 邓正华[1] 刘江[1] 

机构地区：[1]重庆三峡学院机械工程学院,重庆404000

出　　处：《铸造技术》2016年第2期256-258,267,共4页Foundry Technology

基　　金：重庆市教委科学技术研究项目(KJ1401030)

摘　　要：采用脉冲电化学法和阴极沉积法在纯钛表面镀铜,并通过加入铜的络合物氨水对脉冲电化学法的镀液进行改进。利用扫描电镜、X射线能量色散谱仪、轮廓仪、显微硬度计对镀层形貌进行表征。结果表明,与阴极沉积法制备的镀层相比,脉冲电化学法制得的镀层组织更加均匀致密,表面光滑、硬度高,对镀液配方改进后得到的镀层质量进一步提高。The copper plating was prepared by pulse electrochemical and cathodic deposition, and the plating solution of pulse electrochemical method was improved by adding ammonia with the complexes of copper. The microstructure of the plating was represented by scanning electron microscopy （SEM）, energy dispersive X-ray spectrometer （EDXS）, profiler and microhardness. The results show that, compared with the cathodic deposition method, the structure of the copper plating made by pulse electrochemical method has denser structure, smoother surface and higher hardness. The plating quality is enhanced after improving plating solution formula.

关 键 词：脉冲电化学 阴极沉积 钛 镀铜 

分 类 号：TG174.4[金属学及工艺—金属表面处理]