采用等离子干燥工艺提高镀膜附着强度稳定性  

Improving Adhesion Stability of Thin Film with Plasma Drying Technology

作　　者：詹为宇[1] 

机构地区：[1]中国西南电子技术研究所,成都610036

出　　处：《电讯技术》2016年第3期342-345,共4页Telecommunication Engineering

基　　金：国家科技攻关计划项目~~

摘　　要：镀膜工艺设计应能有效脱附物理和化学吸附,才能保证附着强度工艺稳定性。设备运行后腔室内表面沉积物增加,通过分析变化影响探索出一种等离子干燥工艺方法,应用后提高了生产效率,保证了薄膜电路金属叠层间附着强度生产稳定性,满足产品工程应用的可靠性要求。The technical design of thin film plating should desorb the physical and chemical adsorption for stability of adhesion. The equipment vacuum cavity internal face is changed with deposit formation after op-eration. A method with plasma drying to clear depositing is investigated after analyzing this influence. Ap-plication of the method in the thin film plating has raised the productivity effciency,ensured the stability of adhesion between metal platings,and satisfied the reliability requirement of engineering applications.

关 键 词：毫米波组件 薄膜电路 附着强度 等离子干燥 溅射 材料出气 

分 类 号：TN05[电子电信—物理电子学]