基于电镀均匀性改善的一些创新与改进  

Innovation and Improvement of Enhancement of Plating Uniformity

作　　者：陈世金 

机构地区：[1]博敏电子股份有限公司,广东梅州514768

出　　处：《印制电路信息》2016年第3期38-41,共4页Printed Circuit Information

摘　　要：针对电镀过程中电镀槽、阳极遮板、喷管、挡电边条、阴极浮架等影响电镀均匀性的硬件部分,对其合理布局和设计等提出了具体要求,为提升电镀均匀性提出改善依据及思路。In plating process, electroplating bath, anode cover plate, nozzle and baffle electric strake, cathode floating rack electroplating uniform of the hardware part for its reasonable layout and design, puts forward the concrete requirements to improve plating uniformity improve basis and train of thought is put forward.

关 键 词：电镀均匀性 电镀槽 阳极遮板 喷管 挡电边条 阴极浮架 

分 类 号：TN41[电子电信—微电子学与固体电子学]