高速半导体激光器同轴封装工艺误差分析  

Analysis of Coaxial Package Errors with High-Speed Semiconductor Lasers

作　　者：刘勇[1] 李锦华[1] 周雷[1] 司淑平[1] 

机构地区：[1]中国电子科技集团公司第八研究所,合肥230041

出　　处：《中国电子科学研究院学报》2015年第6期652-656,661,共6页Journal of China Academy of Electronics and Information Technology

基　　金：基金项目:10G bps光传输组件

摘　　要：对于高速半导体激光器(LD),由于同轴封装工艺误差对高速LD组件耦合效率的影响,导致高速LD的指标下降。为了减少高速LD同轴封装工艺误差,详细分析高速LD同轴封装误差对高速LD组件耦合效率的影响,得出结论:高速LD组件中管帽倾斜、芯片横向偏移和芯片倾斜这三种情况产生的误差对高速LD组件耦合效率都有影响,其中管帽倾斜误差影响最大。Because the coupling efficiencies of high-speed LD modules is influenced by coaxial packaged errors for the high-speed semiconductor laser（LD）,which results in high-speed LD index decreased.In order to reduce coaxial packaged errors of the high-speed LD,the dependence of the coupling efficiencies of the high-speed LD modules on coaxial packaged errors are analyzed in detail,which reach the conclusion that tilt of the cap,lateral offset of chips and tilt of chips errors that are generated in the three cases have effect on the coupling efficiencies of high-speed LD modules,and tilt of the cap has the greater effects.

关 键 词：耦合效率 同轴封装 芯片横向偏移 芯片倾斜 管帽倾斜 

分 类 号：TN305.94[电子电信—物理电子学]