硅片精密磨削用砂轮的研究综述  

A Survey of Grinding Wheel for Precision Grinding of Silicon Wafer

作　　者：任庆磊[1] 魏昕[1] 谢小柱[1] 胡伟[1] 

机构地区：[1]广东工业大学机电工程学院,广东广州510006

出　　处：《广东工业大学学报》2016年第2期19-23,共5页Journal of Guangdong University of Technology

基　　金：国家自然科学基金资助项目(U0734008);广东省自然科学基金资助项目(8151009001000048);广东工业大学校青年基金资助项目(082042)

摘　　要：砂轮作为硅片精密磨削加工过程中的关键加工工具备受关注.对硅片精密磨削用砂轮的国内外研究情况进行了总结分析,认为在其制备技术研究方面还需进一步的理论支撑;在磨损与观测评价方法研究方面,宜从砂轮建模入手,结合磨削硅片的材料特性,建立不同磨削阶段的砂轮磨削磨损模型;分析其磨损机理,同时优选砂轮观测评价方法,试验验证磨损过程.The grinding wheel is a key processing tool in the precision grinding of silicon wafer. The domestic and foreign research on the grinding wheel for wafer precision grinding is summarized and analyzed,proposing that research on wheel preparation technology need further theoretical support. The research on the wheel wear and evaluation method of observation should firstly establish the wheel model,and analyze the wheel wear mechanism of the different grinding stages according to the material properties of silicon wafer,and finally validate wear process by grinding experiments and using the preferred wheel observation and evaluation method.

关 键 词：硅片 精密磨削 砂轮 磨损 建模 

分 类 号：TG743[金属学及工艺—刀具与模具] TG58