一种无氰碱性光亮镀铜新工艺  

Study on A New Bright Copper Plating in Non- Cyanide Alkaline Solution

作　　者：宋文超 李玉梁 左正忠[2] 熊剑锋 胡哲 

机构地区：[1]武汉吉和昌化工科技有限公司,湖北武汉430023 [2]武汉大学化学与分子科学学院,湖北武汉430072 [3]湖北吉和昌化工科技有限公司,湖北应城432400

出　　处：《材料保护》2016年第3期55-57,61,共4页Materials Protection

摘　　要：为了解决无氰碱性镀铜存在的镀液不稳定、抗杂质能力弱、与工件间结合力差以及镀液排放的废水中含有磷或有机膦等问题,推出了一种新的无氰碱性光亮镀铜新工艺:以柠檬酸(C6H8O7)为Cu2+的主配位剂、丁二酰亚胺(C4H5O2N)为Cu2+的辅助配位剂;使用了超分子化学物质葫芦脲(CB-n)作为防止铜在钢铁件上产生置换的添加剂以及含有聚氨脲、吲哚类、乙氧基醇类等物质的光亮剂。通过小槽试验、Hull Cell试验、阴极极化曲线、机械弯曲、锉刀等方法考察了电镀效果。结果表明:镀液的性能稳定,可得到阴极电流效率在70%~85%、深镀能力为100%的光亮、均匀、结合力好的铜镀层;推荐的溶液组成和操作条件为25~30 g/L Cu SO_4·5H_2O,75~90 g/L C6H8O7,8~10 g/L C4H5O2N,2~5 g/L KNa C4H4O6·4H2O,25~30 g/L H3BO3,90~120 g/L KOH,0.01~0.05mg/L化学置换铜抑制剂CB-n,8~20 m L/L光亮剂,p H值9.0~11.0,Jc=0.2~3.0 A/dm2,温度45~55℃,阳极为纯铜。A novel bright copper plating technique for non-cyanide alkaline solution was proposed in this paper.In this plating solution,citric acid was used as main complexing agent for Cu^(2+),while succinimide was auxiliary complexing agent,and supermolecular compound cucurbituril(CB-n) was applied as an additive to prevent the replacing reaction of copper on steel.Furthermore,some other additives containing polyurethanes urea,indoles,ethoxylated alcohols and alike substances were also used.The plating effects were studied through small cells,Hull cell,cathodic polarization curve,mechanical bending and file cutting.Results showed that the plating solution was very stable,and the bright,homogeneous,tight- binding copper plating layers were obtained with cathodic current efficiency of 70%to 85%and deep plating ability up to 100%.The recommended recipe was as follows:CuSO_4 · 5H_2O 25~30 g/L,C_6H_8O_7 75~90 g/L,C_4H_5O_2N 8~10 g/L,KNaC_4 H_4O_6 · 4H_2O_2 ~ 5 g/L,H_3BO_325~30 g/L,KOH 90 ~ 120 g/L,copper replacement inhibitor(CB-n)0.01~0.05 mg/L,brightener additives 8~20 mL/L,pH = 9.0~11.0,J_e=0.2~3.0 A/dm^2,θ = 45~55 ℃;besides,the anode was pure copper.

关 键 词：镀铜 无氰碱性溶液 柠檬酸 丁二酰亚胺 葫芦脲 光亮剂 

分 类 号：TQ153.14[化学工程—电化学工业]