酸酐复合固化环氧树脂体系覆铜板的研究  

Study on epoxy resin system curing by acid anhydride

作　　者：汪青[1] 冯青[2] 

机构地区：[1]广东生益科技股份有限公司,广东东莞523039 [2]广东创新科技职业学院,广东东莞523960

出　　处：《印制电路信息》2016年第5期19-20,49,共3页Printed Circuit Information

摘　　要：研究了酸酐复合固化环氧树脂体系,得到一种树脂组合物配方,利用该树脂组合物制成的覆铜板具有优异的耐漏电起痕特性、耐热性及阻燃性能。Epoxy resin composition curing by acid anhydride was researched. A kind of resin composition was obtained through the research. Copper clad laminate with high comparative tracking index and highly heat resistance as also as excellent fl ame retardant property was produced by using the resin composition.

关 键 词：酸酐 耐漏电起痕指数 阻燃 覆铜板 

分 类 号：TN41[电子电信—微电子学与固体电子学]