硅微球轴承关键工艺  

Key processes of silicon microball bearing

作　　者：王犇[1] 王晓力[1] 

机构地区：[1]北京理工大学机械与车辆学院,北京100081

出　　处：《吉林大学学报（工学版）》2016年第3期824-830,共7页Journal of Jilin University:Engineering and Technology Edition

基　　金：国家自然科学基金项目(51275046)

摘　　要：首先,对微球轴承的滚道结构、滚动体数目和轴承腔通气孔进行了设计。其次,采用环形刻蚀(Halo etch)技术实现了叶片层上多特征尺寸结构的加工,提高了刻蚀速率的一致性和图形精度,为降低转子不平衡量、提高微球轴承的高速运转稳定性提供保障。此外,利用中间层键合(Intermediate-layer bonds)技术和遮罩(Shadow mask)技术制造出封闭的轴承腔,避免了由于温度过高而产生的微球热变形,同时避免了由于中间层材料沉积在滚道中而引起的轴承腔堵塞和微球粘黏滚道。本研究为微机电系统(MEMS)微球轴承设计和制造提供了新的技术途径。The key processes of silicon microball bearing were investigated.First,the structure of raceway,the number of rolling elements and the nozzle of the bearing chamber of the microball bearing were designed.Then,the Halo Etch technology was employed to fabricate the blade with various characteristic dimensions and to improve the uniformity of etch rate and the pattern precision,thus,reducing the imbalance of rotor and increasing the stability of the microball bearing at high speed. Moreover,the intermediate-layer bonds and shadow mask technologies were used to encapsulate the bearing chamber and reduce the thermal deformation caused by the extremely high temperature and to avoid the clogging of the bearing chamber and the ball raceway adhesion caused by the deposited intermediate materials.A strategy for the design and fabrication of microball bearings in Micro-electromechanical System（MEMS）is provided.

关 键 词：机械制造工艺与设备 微机电系统 微球轴承 环形刻蚀 遮罩 

分 类 号：TH162[机械工程—机械制造及自动化]