硅片自旋转磨削中基于作用力的微观接触仿真研究  

Simulation of micro contact based on interacting force in self rotating grinding of silicon wafer

作　　者：任庆磊[1] 魏昕[1] 谢小柱[1] 胡伟[1] 

机构地区：[1]广东工业大学机电工程学院,广州510006

出　　处：《金刚石与磨料磨具工程》2016年第2期19-23,共5页Diamond & Abrasives Engineering

基　　金：国家自然科学基金资助项目(U0734008);广东省自然科学基金资助项目(8151009001000048);广东工业大学校青年基金资助项目(082042)

摘　　要：采用杯型金刚石砂轮进行硅片自旋转磨削是典型的硅片超精密磨削加工形式。本试验从其磨削过程中抽象出砂轮微单元与硅片的微观接触作为研究对象,建立基于作用力的仿真模型,采用软件LS–DYNA对自旋转磨削微观作用过程进行了模拟,对作用过程中硅片与砂轮微单元的应力应变情况进行了有限元分析。结果表明:硅片材料存在相应弹性转塑性和塑性转脆性的临界位移与载荷;在硅片塑性区域切向滑动时可在硅片表面产生塑性沟槽与隆起;砂轮微单元上的磨损可依据其仿真数据作出判断。研究为硅片磨削及砂轮磨损机理研究提供支撑。Self rotating grinding with cup diamond wheel is a typical ultra precision grinding process for silicon wafer.The simulation model based on the force of micro contact between wheel micro unit and silicon wafer is established from the stable ductile grinding process.Micro contact process of self rotating grinding is simulated using the analysis software LS–DYNA.The stress-strain results between silicon wafer and wheel micro unit are analyzed using finite element method.The results show that there exist critical displacements and loads of elastic-plastic and plastic-brittle transitions when processing silicon wafer.During the tangential sliding in plastic zone,plastic grooves and uplifts appear on silicon surface.Wear of wheel micro unit can be judged based on the simulation data.The research provides support for wafer grinding and wheel wear mechanism.

关 键 词：硅片 自旋转磨削 微观接触 砂轮微单元 仿真 

分 类 号：TG74[金属学及工艺—刀具与模具] TG58