嵌入式软PLC在电镀生产流程控制系统中的应用  

Application of Embedded Soft PLC in Electroplating Production Process Control System

作　　者：夏西泉[1] 

机构地区：[1]重庆电子工程职业学院应用电子学院,重庆401331

出　　处：《电镀与环保》2016年第3期54-57,共4页Electroplating & Pollution Control

摘　　要：以ARM芯片为核心,根据芯片特性并搭配经过改进的双内核Linux操作系统,设计出一种具备良好性能且价格较低的嵌入式软PLC。介绍了嵌入式软PLC的系统结构,阐述了操作系统的选择与改进及运行系统的构建流程,并以常规电镀生产流程控制为例,对嵌入式软PLC的应用效果进行了评价。测试结果表明:嵌入式软PLC的主要性能指标均较好,满足电镀生产流程控制要求。An embedded soft PLC featuring excellent performance and lower price was designed, in which ARM chip was used as the core, and the double-kernel Linux operating system improved according to chip characteristics was selected as the operating system. The system structure of embedded soft PLC was introduced, and the selection as well as improvement of operating system and the construction procedure of running system were also elaborated. Moreover, the application effect of embedded soft PLC was evaluated taking conventional electroplating production process control as an example. Tests showed that the main performance indexes of embedded soft PLC were desirable, indicating that the embedded soft PLC meet electroplating production process control requirements.

关 键 词：控制系统 电镀生产流程 嵌入式软PLC 拓展性 

分 类 号：TQ153[化学工程—电化学工业]