基于平行微隙焊的薄膜传感器和外引线的互连工艺  

Interconnect Techniques between Thin-Film Sensors and Leads Using Parallel Micro Gap Welding

作　　者：王晨曦[1] 田艳红[1] 王春青[1] 

机构地区：[1]哈尔滨工业大学先进焊接与连接国家重点实验室,黑龙江哈尔滨150001

出　　处：《电子工艺技术》2016年第3期125-127,134,共4页Electronics Process Technology

基　　金：国家自然科学基金项目(项目编号:51505106)

摘　　要：采用平行微隙焊的方法,成功实现了5μm厚的Ni Cr合金薄膜与直径为0.15 mm的Ni引线焊接,可用于薄膜传感器外引线的互连。试验结果表明：采用大电流（100~60 A）,短时间（0.5~2 ms）的规范,能够得到较好的焊接接头。并讨论了电极压力对焊接接头的影响,提出在焊接时应采用合适的电极压力。The Ni Cr thin-films（5 mm thick） and Ni leads with 5 mm-diameters were successfully bonded using a parallel micro gap welding method for thin-film sensor interconnects. According to our experimental results, welding joints between the Ni Cr thin-films and Ni leads were achieved with strong currents（100~60 A） and short duration（0.5~2 ms）. The tensile force is high enough. Effects of the electrode force on the welding quality were investigated. It is necessary to choose appropriate electrode forces during welding process.

关 键 词：薄膜传感器 平行微隙焊 电极压力 

分 类 号：TN605[电子电信—电路与系统]