连接温度对Q235/7075铝合金TLP扩散连接接头组织和性能的影响  

Effect of Bonding Temperature on Microstructure and Properties of Q235/7075 Aluminum Alloy Joints with TLP Bonding Process

作　　者：陈思杰[1,2] 李报[1] 邢增为[2] 刘毅辉[2] 郭继玉[2] 赵丕峰[1] 

机构地区：[1]河南理工大学材料科学与工程学院,河南焦作454003 [2]河南第二火电建设公司,河南郑州450051

出　　处：《热加工工艺》2016年第11期68-70,75,共4页Hot Working Technology

基　　金：中国电力建设公司科技项目(DJ-TGYY-2014-08);河南省科技攻关项目(11140035);河南理工大学金属学科基金项目

摘　　要：在开放环境下,用电磁感应加热,氩气保护,以Al-Cu-Si非晶箔作中间层,采用焊接压力为3 MPa、保温时间为5 min,研究了连接温度对Q235/7075铝合金异种材料TLP连接接头组织与力学性能的影响。结果表明,Q235/7075异种材料在连接温度为600℃时形成的TLP扩散连接接头具有较好的抗剪切强度,约为45 MPa。In the experiments, samples were heated by intermediate-frequency induction and the experiments were carried out with the protection of argon in air atmosphere, taking Al-Cu-Si amorphous filler as insert layer, and the welding pressure was 3MPa and the holding time was 5min. Microstructure evolution during transient liquid phase bonding of Q235/7075 aluminum alloy dissimilar materials was investigated. The mechanical properties test was carried out at room temperature. The results show that the shear strength of Q235/7075 aluminum alloy dissimilar materials joint is better（ about 45MPa） when the bonding temperature is at 600℃.

关 键 词：TLP连接 钢/铝异种材料 连接温度 组织性能 

分 类 号：TG453.9[金属学及工艺—焊接]