自整定PID温度控制策略在FOG邦定机中的应用  

Application of the Self-tuning PID Temperature Control Strategy in the FOG Binding Machine

作　　者：赵莹[1] 郭晓妮[1] 

机构地区：[1]太原风华信息装备股份有限公司,山西太原030024

出　　处：《电子工业专用设备》2016年第6期60-63,共4页Equipment for Electronic Products Manufacturing

摘　　要：液晶模组FOG生产工艺中ACF的胶固化和粘结强度直接影响产品的质量和性能。而邦定中温度曲线的控制是影响ACF胶固化和粘结强度的关键,合理的控制温度曲线可以避免ACF邦定过程中针孔和气泡的产生;通过采用自整定PID控制策略合理有效的控制了温度曲线,达到了理想效果。In the production process of LCD module FOG, adhesive curing and bond strength of ACF directly affects the quality of the products and performance. the control of temperature curve is a key to adhesive curing and the adhesive strength of ACF。 Reasonable control temperature curve can avoid pinhole and bubbles In the process of ACF bonding。 The article uses the self-tuning PID control strategy, reasonable and effective control of the temperature curve, reach the ideal effect.

关 键 词：液晶显示设备 柔性电路板邦定至玻璃 PID控制 

分 类 号：TN605[电子电信—电路与系统]