基于“回”型阴极屏蔽板的平面电铸件厚度分布均匀性研究  

Research on Distribution Uniformity of Electroformed Metal Layer by Using Hollow Square Cathode-shielding Plate

作　　者：李慧娟[1] 明平美[1] 周涛 赵云龙[1] 秦歌[1] 

机构地区：[1]河南理工大学机械与动力工程学院,河南焦作454003 [2]昆山美微电子科技有限公司,江苏昆山215334

出　　处：《兵工学报》2016年第6期1075-1081,共7页Acta Armamentarii

基　　金：国家自然科学基金项目(51475149);河南省高等院校科技创新团队支持计划项目(15IRTSTHN013)

摘　　要：为进一步提高大面积平面电铸件厚度分布的均匀性,提出一种改进型电铸工艺——阴极加设"回"字型屏蔽板并做周向等幅平面运动,并对此进行了数值分析与实验研究。研究结果表明:"回"字型屏蔽板结构参数与位置参数对阴极电流密度分布有很大影响,采用改进型电铸工艺能显著改善电铸层厚度的分布特性,基于新工艺制备约为100μm厚的电铸层(大小70 mm×70 mm)的厚度差小于8%.A modified electroforming approach is proposed to further improve the thickness uniformity of electroformed pieces with large areas. The proposed approach involves the addition of a hollow square cathode-shielding plate to the cathode which translates circumferentially. Some simulations and experi- ments were carried out to study the proposed method. The research results show that both geometrical fea- ture parameters and placement positions of hollow square cathode-shielding plate have great effects on the cathode current density distribution. The thickness distribution of deposited metal can be significantly im- proved using the modified process in which thickness deviation of less than 8% is achieved for 100 i^m thick deposit （70 mm x 70 mm）. The proposed electroforming approach is expected to provide an upgra- ded alternative for preparing the considerably uniform large-area fiat electroformed layers.

关 键 词：机械制造工艺与设备 电铸 厚度分布均匀性 阴极屏蔽板 阴极周向平动 

分 类 号：TQ153.4[化学工程—电化学工业]