电镀电流参数的节能PID控制方法  

The PID Control Method of Plating Current Parameters for Saving Energy

作　　者：赵鹏[1] 毕立恒[1] 

机构地区：[1]黄河水利职业技术学院自动化工程系,河南开封475004

出　　处：《电镀与精饰》2016年第7期23-27,共5页Plating & Finishing

基　　金：河南省科技发展计划基础与前沿研究项目(项目编号:132300410142河南科技厅)

摘　　要：电镀是将电能转换成化学能的过程,转换过程中电流不能合理控制是影响电镀工艺的重要因素。提出电镀电流参数优化的PID控制方法,在传统PID电流控制的基础上,将Min Max原则和电流密度范围、被镀工件表面积等指标作为约束条件,进行PID参数整定,使电镀过程充分考虑这些因素,实现在约束条件下的最优工艺控制。仿真实验表明,该方法可以较好的降低电镀过程的能耗。The electroplating is a process to convert the electrical energy into chemical energy. It is the main factor to influence the electroplating process that current in this process cant be controlled appropri- ately. This paper presents the PID control method to optimize the electroplating current parameter. On the basis of traditional PID current control, the MinMax Principle, current density range and the surface area of the plated workpiece, are as constraints. The PID parameter setting is conducted, so as to take full con- sideration of these factors into electroplating process, to achieve the optimize process control under these constraint conditions. The simulation experiment shows that this method can well reduce the energy con- sumption of the electroplating process.

关 键 词：PID控制器 闭环控制系统结构 PID整定方法 

分 类 号：TM762[电气工程—电力系统及自动化]