Sn元素在磁控溅射Al-Fe-Sn合金薄膜结构变化中的作用  

Role of Tin in the Structural Evolution of Al-Fe-Sn Alloy Thin Film

作　　者：赵冠楠[1] 侯振国[1] 谢玉叶 郑增[1] 严彪[1] 

机构地区：[1]同济大学材料科学与工程学院,上海200000

出　　处：《有色金属材料与工程》2016年第3期84-89,共6页Nonferrous Metal Materials and Engineering

摘　　要：利用磁控溅射法制备了Al-Fe-Sn合金薄膜,并综合利用透射电子显微镜(TEM)、X射线衍射仪(XRD)和光电子能谱仪(XPS)等测试手段,获得了溅射态及550℃退火态Al-Fe-Sn合金薄膜的结构及成分信息,并在此基础上,对Sn元素在所制备出的Al-Fe合金薄膜中相变的作用提出了相关模型.在所采用的溅射工艺下,得到Sn在α-Al中的固溶体.在退火过程中,Sn首先会从Al基体中脱溶出来,在表面优先富集.当退火温度进一步升高至550℃时,在晶界处残余的Sn会重新固溶进入Al基体中,通过与Al原子结合对Al-Fe相的生成起到阻碍作用,并且使得扩散进入薄膜的Si与Fe结合,进而形成ε-FeSi相.Al-Fe-Sn alloy thin film was fabricated via DC magnetron sputtering process. TEM-XRD-XPS et al were employed to characterize the compositional and microstructural evolution ofthe thin film during 550 °C isothermal annealing. A model on the role played by Tin in the phasetransition of Al-Fe alloy was proposed herewith. In the as-deposited film, tin was contained in Almatrix as solute elements which then dissolved and enriched at the film surface during annealing.When the temperature was further elevated, the remaining Tin in the grain boundary would be resolvedinto the grains. The nucleation of Al-Fe intermetallic compounds are prohibited due tobinding affinity between Tin and Aluminum atoms. The binding between iron atoms with silicondiffused into the film led to the formation of e-FeSi phase.

关 键 词：磁控溅射法 铝合金 相变 Al-Fe合金薄膜 

分 类 号：TG146.21[一般工业技术—材料科学与工程] TB383.2[金属学及工艺—金属材料]