微电子封装微尺度球栅阵列焊点三点弯曲应力应变分析  

STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING

作　　者：梁颖[1] 黄春跃[2] 殷芮 黄伟[2] 李天明[3] 赵宏旺[3] 

机构地区：[1]成都航空职业技术学院电子工程系,成都610100 [2]桂林电子科技大学机电工程学院,桂林541004 [3]桂林航天工业学院汽车与动力工程系,桂林541004

出　　处：《机械强度》2016年第4期744-748,共5页Journal of Mechanical Strength

基　　金：国家自然科学基金(51465012);广西壮族自治区自然科学基金(2015GXNSFCA139006;2013GXNSFAA019322);四川省教育厅科研项目(13ZB0052)资助~~

摘　　要：建立了微尺度球栅阵列焊点三点弯曲应力应变有限元分析模型,在三点弯曲加载条件下,分析了焊点直径、焊点高度、焊盘直径和弯曲加载速率对焊点弯曲应力应变的影响。结果表明:焊点内最大弯曲应力应变随焊点直径、焊点高度和弯曲加载速率的增大而增大、随焊盘直径的增大而减小;在置信度为90%时,焊点直径对焊点内最大弯曲应力具有显著影响,焊点高度和焊盘直径对最大弯曲应力影响不显著,焊点直径对最大弯曲应力产生影响最大、焊盘直径对最大弯曲应力产生影响次之,而焊点高度对最大弯曲应力产生影响最小。The miniature ball grid array（ BGA） solder joint three point bending stress and strain finite element analysis models were set up,and the influences of ball diameter,ball height,pad diameter and bending load speed on the stress and strain of miniature BGA solder joints were analyzed under the three point bending load. The results show that both of the maximum stress and strain of miniature BGA solder joints increase with the increase of the ball diameter,ball height and bending load speed respectively,whereas reduce with the increase of the pad diameter. With 90% confidence,the ball diameter has a certain effect on the maximum bending stress,the ball height and the pad diameter have no significant effect on the maximum stress of miniature BAG solder joint. The ball diameter,pad diameter,ball height affect the maximum stress of miniature BGA solder joints in a descending order.

关 键 词：微电子封装 球栅阵列焊点 三点弯曲加载 有限元分析 应力应变 

分 类 号：TG404[金属学及工艺—焊接]